Scientists observed that Boron arsenide beats diamond in thermal conductivity
The researchers found that boron arsenide exceeded diamond in heat conduction, offering better thermal management for electronics. Scientists have long hailed diamond as nature’s ultimate heat conductor, but that crown may now belong to a synthetic crystal. Researchers at the University of Houston have discovered that boron arsenide (BAs) can surpass diamond in carrying heat, rewriting what physicists thought they knew about thermal conductivity. Boron arsenide has dethroned diamond as the best heat conductor, thanks to refined crystal purity and improved synthesis methods. Now researchers have achieved a major scientific milestone in the study of heat transfer. This discovery could transform next-generation electronics by combining record-breaking thermal conductivity with strong semiconductor properties. Boron arsenide just rewriting the rules of heat conduction and semiconductor design. The new findings overturn long-standing assumptions about thermal conductivity and reveal that boron arsenide (BAs) can conduct heat more effectively than diamond, which has long been considered the benchmark among isotropic materials.
The study is part of a $2.8 million National Science Foundation project led by Bolin Liao at UC Santa Barbara, with contributions from the University of Houston, the University of Notre Dame and UC Irvine. The research also receives partial support from industrial partner Qorvo. The researchers found that high-quality boron arsenide crystals achieved thermal conductivity above 2,100 watts/meter/Kelvin (W/mK) at room temperature, possibly higher than that of diamond. For decades, diamond held the record among isotropic materials, meaning those with uniform properties in all directions. The research team discovered that when BAs crystals are produced with exceptional purity, they can reach thermal conductivity values possibly surpassing diamond itself. The study challenges existing theoretical models and could reshape how scientists think about heat movement through solid materials. The results also point to a promising new semiconductor option for devices which demand advanced thermal management, including smartphones, high-power electronics and data centres.
The finding not only challenges existing theories but could reshape how electronics handle heat. From smartphones to data centers, efficient thermal management is critical for performance and longevity. The discovery could usher in a new era of materials which make chips cooler, faster and long-lasting. “We trust our measurement; our data is correct and that means the theory needs correction,” said Zhifeng Ren, corresponding author and professor in UH’s Department of Physics. “I’m not saying the theory is wrong, but an adjustment needs to be made to be consistent with the experimental data.” By refining raw arsenic and developing improved synthesis methods, the UH-led team created boron arsenide crystals with significantly fewer imperfections. When tested, these high-purity samples demonstrated a remarkable thermal conductivity above 2,100 W/mK, surpassing not only earlier experimental results but also the theoretical ceiling itself. The discovery emerged from a collaboration among the University of Houston's Texas Center for Superconductivity (directed by Ren), the University of California, Santa Barbara, and Boston College.
For years, boron arsenide was theorized to rival diamond’s heat conduction, but experiments consistently fell short. Boron arsenide has intrigued scientists earlier. In 2013, Boston College physicist and study co-author David Broido and colleagues predicted that BAs could theoretically conduct heat as efficiently, or even better, than diamond. However, revised models in 2017 added a complex factor known as four-phonon scattering, which reduced predicted performance to around 1,360 W/mK. This caused many in the field to abandon the idea that BAs could exceed diamond's conductivity. Ren's group, however, suspected the problem wasn't the material's intrinsic ability but the impurities within it. Earlier experimental samples contained defects that limited performance to about 1,300 W/mK, well below the ideal conditions used in theoretical predictions. This achievement confirms that material purity plays a decisive role in heat transfer performance and opens a path toward even more efficient heat-conducting materials.
“We trust our measurement; our data is correct and that means the theory needs correction,” Ren repeated, underscoring how real-world data outpaced the math. Boron arsenide’s advantages stretch far beyond breaking records. It’s not just an exceptional thermal conductor, it’s also a promising semiconductor. The implications of this breakthrough extend far beyond laboratory measurements. Boron arsenide has the potential to revolutionize electronics and semiconductor technology by providing a material which both dissipates heat effectively and performs as a high-quality semiconductor. Its advantages include the following:-
Exceptional thermal conductivity combined with efficient semiconductor behaviour.
Potentially superior electronic performance compared to silicon due to its high carrier mobility, wide band gap and well-matched coefficient of thermal expansion.
Easier and more cost-effective manufacturing compared to diamond, without the need for extreme temperature or pressure.
Although this discovery marks a new frontier, the work is on going. Researchers at the Texas Centre for Superconductivity plan to continue refining their methods, aiming to enhance boron arsenide's performance even further. "This new material, it's so wonderful," Ren said. "It has the best properties of a good semiconductor, and a good thermal conductor, all sorts of good properties in one material. That has never happened in other semiconducting materials." The combination makes it a rare candidate to outperform silicon, the foundation of modern electronics. Its coefficient of thermal expansion is also well-matched for chip integration, making it ideal for next-generation devices. Ren encourages scientists to revisit existing models and challenge theoretical assumptions that may have underestimated materials like BAs. "You shouldn't let a theory prevent you from discovering something even bigger, and this exactly happened in this work," Ren said. The breakthrough could have far-reaching applications in AI hardware, power electronics and high-performance computing, where overheating limits innovation. Still, the researchers say their work is just beginning. The team plans to refine their methods to push BAs’ performance even higher in the future.
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